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CAD Design Software (CDS) provides EDA design and layout software based on the AutoCAD OEM graphics engine. Its core product, Electronics Packaging Designer (EPD), is aimed at specialized electronic design scenarios such as semiconductor packaging, ceramic MCM/LTCC, RF/microwave, PCB, and Flex. The official website emphasizes that it was developed by designers and engineers based on real-world design office needs, with more than 25 years of software experience built on the AutoCAD engine.
The product is divided into suites such as EPD Professional, Standard, Basic, and Starter, covering everything from entry-level PCB/Schematic/DRC/Gerber output to advanced IC Packaging, Die Bump, BGA, Lead Frame, Hybrid MCM, GDS In/Out, and routing. Its highlights include reading, writing, and converting formats such as Gerber, GDSII, IDF, SAT/ACIS, ODB++, and Bondwire, as well as exporting wire bonding equipment formats for Hesse, Palomar, and others. The tool also supports LVS, DRC, CAM capabilities, and generating 3D ACIS solids from 2D contours.
The official website does not disclose pricing, license terms, concurrent licensing, or trial policies. It only confirms the availability of multiple design suites and standalone conversion tools. For enterprise procurement, further contact with the vendor is required to confirm licensing, maintenance services, training, and localized support.
The advantages are its strong vertical focus, making it especially suitable for complex scenarios that ordinary PCB tools struggle to cover, such as semiconductor packaging, LTCC/HTCC, RF, and hybrid circuits. It also places emphasis on interoperability with existing workflows, supporting interface plugins for Mentor Graphics, Cadence, Altium Designer, and others. The drawbacks are the lack of cloud collaboration, team permissions, auditing, and security compliance information commonly found in modern SaaS offerings. The website content is more product-marketing oriented and lacks quantifiable deployment and service terms.
Suitable for packaging houses, substrate manufacturers, RF/microwave design teams, defense/research laboratories, and university training institutions, especially teams that already have CAD/EDA workflows but need to improve packaging and substrate design efficiency.
Based on the crawled text, access conditions in mainland China cannot be determined and are marked as unknown.
⚠ This review is compiled from public sources and does not constitute a purchase recommendation. Verify all facts on the vendor's official site. Verify on cad-design.com official site.
cad-design.com is an United States Dev Tools provider. TG4G tracks its product information, an overall rating of 6.0/10, and a China-accessibility score of Workable. Click "Visit Official Site" to reach cad-design.com directly.